BDN09-3CB
CTS Thermal Management Products

CTS Thermal Management Products
HEATSINK CPU .91" SQ
$1.80
Available to order
Reference Price (USD)
1+
$1.92000
10+
$1.82600
25+
$1.77840
50+
$1.73020
100+
$1.63400
250+
$1.53792
500+
$1.44180
1,000+
$1.34568
5,000+
$1.29762
Exquisite packaging
Discount
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EMS | 3-7 days |
CTS Thermal Management Products BDN09-3CB is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.
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Product details
The BDN09-3CB from CTS Thermal Management Products is a high-efficiency thermal heat sink designed to provide exceptional cooling for a wide range of applications. Its advanced design ensures optimal heat dissipation, making it ideal for use in high-power electronics, industrial machinery, and more. The BDN09-3CB excels in environments where temperature control is critical, offering reliable performance and durability. Its innovative fin design enhances airflow and heat transfer, ensuring efficient cooling even under heavy loads. Industries such as automotive, aerospace, and telecommunications can benefit from its superior thermal management capabilities. In the automotive sector, it is perfect for cooling electric vehicle components, while in aerospace, it ensures the reliability of avionics systems. Telecommunications equipment also benefits from its ability to maintain stable temperatures in base stations and networking gear. CTS Thermal Management Products has engineered this heat sink to meet the highest industry standards, ensuring long-lasting performance and reliability. Its versatile design allows for easy integration into various systems, making it a cost-effective solution for thermal management. For businesses looking to enhance their cooling strategies, the BDN09-3CB offers a proven solution backed by CTS Thermal Management Products's expertise. Don't let heat-related issues impact your operations reach out to us today to request a quote and learn how this heat sink can benefit your application.
General specs
- Product Status: Active
- Type: Top Mount
- Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
- Attachment Method: Thermal Tape, Adhesive (Not Included)
- Shape: Square, Pin Fins
- Length: 0.910" (23.11mm)
- Width: 0.910" (23.11mm)
- Diameter: -
- Fin Height: 0.355" (9.02mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: 9.60°C/W @ 400 LFM
- Thermal Resistance @ Natural: 26.90°C/W
- Material: Aluminum
- Material Finish: Black Anodized