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HSB04-171706

CUI Devices
HSB04-171706 Preview
CUI Devices
HEAT SINK, BGA, 17 X 17 X 6 MM
$0.56
Available to order
Reference Price (USD)
1+
$0.56237
500+
$0.5567463
1000+
$0.5511226
1500+
$0.5454989
2000+
$0.5398752
2500+
$0.5342515
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CUI Devices HSB04-171706 is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.

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HSB04-171706

HSB04-171706

$0.56

Product details

Discover the HSB04-171706 thermal heat sink from CUI Devices, a high-performance solution designed to meet the demanding cooling needs of modern industries. This heat sink is engineered for superior heat dissipation, ensuring reliable thermal management in high-power applications. Its robust construction and advanced design make it an ideal choice for industries such as automotive, aerospace, and renewable energy. In the automotive sector, the HSB04-171706 provides essential cooling for electric vehicle batteries and power electronics. Aerospace applications benefit from its ability to maintain optimal temperatures in avionics and other critical systems. The renewable energy industry also relies on its efficient cooling capabilities for solar inverters and wind turbine components. CUI Devices has crafted this heat sink with precision, using high-quality materials to ensure durability and long-term performance. Its innovative fin design maximizes surface area for improved heat transfer, making it a standout choice for engineers and designers. For businesses seeking a dependable thermal solution, the HSB04-171706 delivers the performance and reliability you need. Whether you're in the manufacturing, telecommunications, or medical device industry, this heat sink can help you achieve better thermal efficiency. Ready to upgrade your cooling system? Contact us today to request a quote and discover how the HSB04-171706 can meet your specific needs.

General specs

  • Product Status: Active
  • Type: Top Mount
  • Package Cooled: BGA
  • Attachment Method: Adhesive
  • Shape: Square, Pin Fins
  • Length: 0.669" (17.00mm)
  • Width: 0.669" (17.00mm)
  • Diameter: -
  • Fin Height: 0.236" (6.00mm)
  • Power Dissipation @ Temperature Rise: 2.5W @ 75°C
  • Thermal Resistance @ Forced Air Flow: 13.10°C/W @ 200 LFM
  • Thermal Resistance @ Natural: 29.73°C/W
  • Material: Aluminum Alloy
  • Material Finish: Black Anodized

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