HSB18-232310
CUI Devices

CUI Devices
HEAT SINK, BGA, 23 X 23 X 10 MM
$1.04
Available to order
Reference Price (USD)
1+
$1.04000
500+
$1.0296
1000+
$1.0192
1500+
$1.0088
2000+
$0.9984
2500+
$0.988
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
DHL / Fedex / UPS | 2-5 days |
TNT | 2-6 days |
EMS | 3-7 days |
CUI Devices HSB18-232310 is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.
Experience hassle-free transactions with our flexible payment options and credit facilities. Learn more about the various payment methods accepted, installment plans, and any exclusive credit offers available to make your shopping experience seamless.
Product details
The HSB18-232310 from CUI Devices is a high-performance thermal heat sink designed to efficiently dissipate heat in various industrial applications. Engineered for optimal thermal management, this heat sink ensures reliable performance even in demanding environments. Its robust construction and advanced design make it an ideal choice for applications requiring consistent cooling solutions. Whether you're dealing with high-power electronics or precision machinery, the HSB18-232310 delivers unmatched heat dissipation to keep your equipment running smoothly. The CUI Devices heat sink is crafted with precision to meet the highest industry standards, ensuring durability and long-term reliability. Its versatile design allows for easy integration into existing systems, making it a cost-effective solution for thermal management. With its superior heat transfer capabilities, the HSB18-232310 is a must-have for any application where temperature control is critical. Industries such as automotive, aerospace, and telecommunications can benefit greatly from this advanced cooling solution. The HSB18-232310 is also perfect for use in renewable energy systems, where efficient heat dissipation is essential for optimal performance. For those in the medical device industry, this heat sink provides the precision cooling needed for sensitive equipment. To get a customized quote for your specific needs, contact us today and let our experts assist you in finding the perfect thermal solution.
General specs
- Product Status: Active
- Type: Top Mount
- Package Cooled: BGA
- Attachment Method: Adhesive
- Shape: Square, Pin Fins
- Length: 0.906" (23.00mm)
- Width: 0.906" (23.00mm)
- Diameter: -
- Fin Height: 0.394" (10.00mm)
- Power Dissipation @ Temperature Rise: 3.7W @ 75°C
- Thermal Resistance @ Forced Air Flow: 6.80°C/W @ 200 LFM
- Thermal Resistance @ Natural: 20.41°C/W
- Material: Aluminum Alloy
- Material Finish: Black Anodized