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HSB21-454515

CUI Devices
HSB21-454515 Preview
CUI Devices
HEAT SINK, BGA, 45 X 45 X 15 MM
$2.03
Available to order
Reference Price (USD)
1+
$2.03000
500+
$2.0097
1000+
$1.9894
1500+
$1.9691
2000+
$1.9488
2500+
$1.9285
Exquisite packaging
Discount
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DHL / Fedex / UPS 2-5 days
TNT 2-6 days
EMS 3-7 days

CUI Devices HSB21-454515 is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.

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HSB21-454515

HSB21-454515

$2.03

Product details

The HSB21-454515 by CUI Devices is a cutting-edge thermal heat sink designed to provide exceptional cooling for a wide range of industrial applications. Its high-efficiency design ensures optimal heat dissipation, making it suitable for high-power electronics, industrial machinery, and more. The HSB21-454515 excels in environments where temperature control is critical, offering reliable performance and durability. Industries such as automotive, aerospace, and telecommunications can benefit from its superior thermal management capabilities. In the automotive sector, it is ideal for cooling electric vehicle components, while in aerospace, it ensures the reliability of avionics systems. Telecommunications equipment also benefits from its ability to maintain stable temperatures in networking gear and base stations. CUI Devices has engineered this heat sink to meet the highest industry standards, ensuring long-lasting performance and reliability. Its versatile design allows for easy integration into various systems, making it a cost-effective solution for thermal management. For businesses looking to enhance their cooling strategies, the HSB21-454515 offers a proven solution backed by CUI Devices's expertise. Don't let heat-related issues disrupt your operations reach out to us today to request a quote and discover how this heat sink can benefit your application.

General specs

  • Product Status: Active
  • Type: Top Mount
  • Package Cooled: BGA
  • Attachment Method: Adhesive
  • Shape: Square, Pin Fins
  • Length: 1.772" (45.00mm)
  • Width: 1.772" (45.00mm)
  • Diameter: -
  • Fin Height: 0.591" (15.00mm)
  • Power Dissipation @ Temperature Rise: 9.9W @ 75°C
  • Thermal Resistance @ Forced Air Flow: 2.80°C/W @ 200 LFM
  • Thermal Resistance @ Natural: 7.56°C/W
  • Material: Aluminum Alloy
  • Material Finish: Black Anodized

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