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HSB28-606022

CUI Devices
HSB28-606022 Preview
CUI Devices
HEAT SINK, BGA, 60 X 60 X 22 MM,
$6.63
Available to order
Reference Price (USD)
1+
$6.63000
500+
$6.5637
1000+
$6.4974
1500+
$6.4311
2000+
$6.3648
2500+
$6.2985
Exquisite packaging
Discount
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DHL / Fedex / UPS 2-5 days
TNT 2-6 days
EMS 3-7 days

CUI Devices HSB28-606022 is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.

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HSB28-606022

HSB28-606022

$6.63

Product details

Upgrade your thermal management with the HSB28-606022 heat sink from CUI Devices, a high-efficiency solution designed for superior heat dissipation. This heat sink is perfect for applications requiring reliable cooling, such as high-power electronics, industrial machinery, and telecommunications equipment. Its innovative design maximizes thermal transfer, ensuring optimal performance even in demanding environments. The HSB28-606022 is an excellent choice for the automotive industry, where it can be used to cool electric vehicle batteries and power electronics. In the aerospace sector, it provides essential cooling for avionics and other critical systems. The renewable energy industry also benefits from its ability to maintain efficient operation of solar inverters and wind turbine components. CUI Devices has engineered this heat sink to meet the highest industry standards, ensuring durability and long-term reliability. Its compact design allows for easy integration into existing systems, making it a cost-effective solution for thermal management. For businesses seeking a dependable cooling solution, the HSB28-606022 delivers performance you can trust. Whether you're in the manufacturing, medical, or telecommunications industry, this heat sink can help you achieve better thermal efficiency. Ready to take the next step? Contact us today to request a quote and learn how the HSB28-606022 can meet your specific needs.

General specs

  • Product Status: Active
  • Type: -
  • Package Cooled: -
  • Attachment Method: -
  • Shape: -
  • Length: -
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  • Power Dissipation @ Temperature Rise: -
  • Thermal Resistance @ Forced Air Flow: -
  • Thermal Resistance @ Natural: -
  • Material: -
  • Material Finish: -

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