HSE-B2111-038
CUI Devices

CUI Devices
HEAT SINK, EXTRUSION, TO-220, 25
$0.55
Available to order
Reference Price (USD)
1+
$0.36000
10+
$0.34600
25+
$0.32880
50+
$0.32000
100+
$0.31570
250+
$0.29412
500+
$0.27680
1,000+
$0.25085
5,000+
$0.24220
Exquisite packaging
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TNT | 2-6 days |
EMS | 3-7 days |
CUI Devices HSE-B2111-038 is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.
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Product details
Upgrade your thermal management with the HSE-B2111-038 heat sink from CUI Devices, a high-efficiency solution designed for superior heat dissipation. This heat sink is perfect for applications requiring reliable cooling, such as high-power electronics, industrial machinery, and telecommunications equipment. Its innovative design maximizes thermal transfer, ensuring optimal performance even in demanding environments. The HSE-B2111-038 is an excellent choice for the automotive industry, where it can be used to cool electric vehicle batteries and power electronics. In the aerospace sector, it provides essential cooling for avionics and other critical systems. The renewable energy industry also benefits from its ability to maintain efficient operation of solar inverters and wind turbine components. CUI Devices has engineered this heat sink to meet the highest industry standards, ensuring durability and long-term reliability. Its compact design allows for easy integration into existing systems, making it a cost-effective solution for thermal management. For businesses seeking a dependable cooling solution, the HSE-B2111-038 delivers performance you can trust. Whether you're in the manufacturing, medical, or telecommunications industry, this heat sink can help you achieve better thermal efficiency. Ready to take the next step? Contact us today to request a quote and learn how the HSE-B2111-038 can meet your specific needs.
General specs
- Product Status: Active
- Type: Board Level
- Package Cooled: TO-220
- Attachment Method: Bolt On
- Shape: Rectangular, Fins
- Length: 0.984" (25.00mm)
- Width: 0.625" (16.00mm)
- Diameter: -
- Fin Height: 0.354" (9.00mm)
- Power Dissipation @ Temperature Rise: 3.8W @ 75°C
- Thermal Resistance @ Forced Air Flow: 6.12°C/W @ 200 LFM
- Thermal Resistance @ Natural: 19.74°C/W
- Material: Aluminum Alloy
- Material Finish: Black Anodized