HSET860-BGA-1
iBASE Technology
iBASE Technology
HEATSINK FOR ET860(H051HSET860B0
$16.84
Available to order
Reference Price (USD)
1+
$16.84000
500+
$16.6716
1000+
$16.5032
1500+
$16.3348
2000+
$16.1664
2500+
$15.998
Exquisite packaging
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| EMS | 3-7 days |
iBASE Technology HSET860-BGA-1 is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.
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HSET860-BGA-1
$16.84
Product details
Discover the HSET860-BGA-1 thermal heat sink from iBASE Technology, a high-performance solution designed to meet the demanding cooling needs of modern industries. This heat sink is engineered for superior heat dissipation, ensuring reliable thermal management in high-power applications. Its robust construction and advanced design make it an ideal choice for industries such as automotive, aerospace, and renewable energy. In the automotive sector, the HSET860-BGA-1 provides essential cooling for electric vehicle batteries and power electronics. Aerospace applications benefit from its ability to maintain optimal temperatures in avionics and other critical systems. The renewable energy industry also relies on its efficient cooling capabilities for solar inverters and wind turbine components. iBASE Technology has crafted this heat sink with precision, using high-quality materials to ensure durability and long-term performance. Its innovative fin design maximizes surface area for improved heat transfer, making it a standout choice for engineers and designers. For businesses seeking a dependable thermal solution, the HSET860-BGA-1 delivers the performance and reliability you need. Whether you're in the manufacturing, telecommunications, or medical device industry, this heat sink can help you achieve better thermal efficiency. Ready to upgrade your cooling system? Contact us today to request a quote and discover how the HSET860-BGA-1 can meet your specific needs.
General specs
- Product Status: Active
- Type: Top Mount
- Package Cooled: ET860
- Attachment Method: -
- Shape: -
- Length: -
- Width: -
- Diameter: -
- Fin Height: -
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material: -
- Material Finish: -
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