RAS-HS-C
Micro Connectors, Inc.

Micro Connectors, Inc.
HEATSINK RASPBERRY PI ALUM/COP
$8.25
Available to order
Reference Price (USD)
1+
$8.25000
500+
$8.1675
1000+
$8.085
1500+
$8.0025
2000+
$7.92
2500+
$7.8375
Exquisite packaging
Discount
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DHL / Fedex / UPS | 2-5 days |
TNT | 2-6 days |
EMS | 3-7 days |
Micro Connectors, Inc. RAS-HS-C is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.
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Product details
Upgrade your thermal management with the RAS-HS-C heat sink from Micro Connectors, Inc., a high-efficiency solution designed for superior heat dissipation. This heat sink is perfect for applications requiring reliable cooling, such as high-power electronics, industrial machinery, and telecommunications equipment. Its innovative design maximizes thermal transfer, ensuring optimal performance even in demanding environments. The RAS-HS-C is an excellent choice for the automotive industry, where it can be used to cool electric vehicle batteries and power electronics. In the aerospace sector, it provides essential cooling for avionics and other critical systems. The renewable energy industry also benefits from its ability to maintain efficient operation of solar inverters and wind turbine components. Micro Connectors, Inc. has engineered this heat sink to meet the highest industry standards, ensuring durability and long-term reliability. Its compact design allows for easy integration into existing systems, making it a cost-effective solution for thermal management. For businesses seeking a dependable cooling solution, the RAS-HS-C delivers performance you can trust. Whether you're in the manufacturing, medical, or telecommunications industry, this heat sink can help you achieve better thermal efficiency. Ready to take the next step? Contact us today to request a quote and learn how the RAS-HS-C can meet your specific needs.
General specs
- Product Status: Active
- Type: Top Mount Kit
- Package Cooled: Raspberry Pi 2B, 3B, 3B+, 4B, B+
- Attachment Method: Thermal Tape, Adhesive (Included)
- Shape: Rectangular, Fins; Square, Fins
- Length: -
- Width: -
- Diameter: -
- Fin Height: -
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material: Aluminum, Copper
- Material Finish: -