TH235-2-500G-JAR
Penchem Technologies Sdn Bhd
Penchem Technologies Sdn Bhd
NON SILICONE THERMAL PUTTY
$93.30
Available to order
Reference Price (USD)
1+
$93.30000
500+
$92.367
1000+
$91.434
1500+
$90.501
2000+
$89.568
2500+
$88.635
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
| DHL / Fedex / UPS | 2-5 days |
| TNT | 2-6 days |
| EMS | 3-7 days |
Penchem Technologies Sdn Bhd TH235-2-500G-JAR is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.
Experience hassle-free transactions with our flexible payment options and credit facilities. Learn more about the various payment methods accepted, installment plans, and any exclusive credit offers available to make your shopping experience seamless.
TH235-2-500G-JAR
$93.30
Product details
The TH235-2-500G-JAR from Penchem Technologies Sdn Bhd is a cutting-edge thermal epoxy designed for high-stakes thermal management applications. Falling under the Thermal - Adhesives, Epoxies, Greases, Pastes classification, this epoxy combines superior thermal conductivity with robust mechanical strength. The TH235-2-500G-JAR is engineered to withstand extreme temperatures and harsh conditions, making it ideal for industries where reliability is paramount. Its fast-curing formula reduces assembly time, while its high bond strength ensures long-term durability.
This thermal epoxy is electrically insulating and resistant to chemicals, safeguarding sensitive components. Its low shrinkage during curing prevents stress on bonded parts, maintaining structural integrity. The TH235-2-500G-JAR is easy to dispense and apply, making it a practical choice for high-volume production.
Key applications include: 1) Bonding heat sinks in military electronics, 2) Securing components in downhole drilling equipment, and 3) Assembling high-power LED systems. The TH235-2-500G-JAR is trusted for its performance in the most demanding environments.
Enhance your thermal solutions with the TH235-2-500G-JAR. Contact Penchem Technologies Sdn Bhd today to discuss your needs and request a quote. Our team is here to provide expert guidance and top-quality products.
General specs
- Product Status: Active
- Type: Non-Silicone Putty
- Size / Dimension: 500 gram Container
- Usable Temperature Range: 5°F ~ 248°F (-15°C ~ 200°C)
- Color: Blue
- Thermal Conductivity: 4.00W/m-K
- Features: -
- Shelf Life: 18 Months
- Storage/Refrigeration Temperature: -
Viewed products
