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SEAMP-10-02.0-L-04

Samtec Inc.
SEAMP-10-02.0-L-04 Preview
Samtec Inc.
CONN HD ARRAY M 40POS PRESS-FIT
$9.89
Available to order
Reference Price (USD)
1+
$9.88988
500+
$9.7909812
1000+
$9.6920824
1500+
$9.5931836
2000+
$9.4942848
2500+
$9.395386
Exquisite packaging
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Samtec Inc. SEAMP-10-02.0-L-04 is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.

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SEAMP-10-02.0-L-04

SEAMP-10-02.0-L-04

$9.89

Product details

Engineered for mission-critical applications, Samtec Inc.'s SEAMP-10-02.0-L-04 edge-type mezzanine connector delivers exceptional performance in rectangular array configurations. This board-to-board solution combines high contact density with reliable power distribution capabilities. The precision contacts ensure minimal insertion loss and stable impedance characteristics for high-speed data transmission. Ideal for aerospace avionics, defense systems, and industrial automation equipment, the connector maintains secure connections in high-vibration environments. Its robust construction meets stringent requirements for shock and impact resistance. The SEAMP-10-02.0-L-04 finds extensive use in energy management systems, medical imaging devices, and telecommunications infrastructure. The optimized pin arrangement supports mixed-signal transmission with effective noise isolation. Key benefits include extended service life, simplified assembly processes, and compatibility with automated placement equipment. For applications demanding dependable inter-board connections, this connector series provides proven solutions. Request technical documentation and pricing information by completing our brief online inquiry form.

General specs

  • Product Status: Active
  • Connector Type: High Density Array, Male
  • Number of Positions: 40
  • Pitch: 0.050" (1.27mm)
  • Number of Rows: 4
  • Mounting Type: Through Hole
  • Features: -
  • Contact Finish: Gold
  • Contact Finish Thickness: 100.0µin (2.54µm)
  • Mated Stacking Heights: 7mm
  • Height Above Board: 0.181" (4.60mm)

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