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1963783-2

TE Connectivity AMP Connectors
1963783-2 Preview
TE Connectivity AMP Connectors
QSFP DOUBLE SAN HEATSINK 6.5MM
$9.99
Available to order
Reference Price (USD)
1,320+
$7.63516
Exquisite packaging
Discount
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DHL / Fedex / UPS 2-5 days
TNT 2-6 days
EMS 3-7 days

TE Connectivity AMP Connectors 1963783-2 is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.

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1963783-2

1963783-2

$9.99

Product details

The 1963783-2 by TE Connectivity AMP Connectors is a top-tier thermal heat sink designed to deliver exceptional cooling performance in a variety of industrial applications. Its advanced engineering ensures efficient heat dissipation, making it suitable for high-power electronics, industrial machinery, and more. The 1963783-2 is built to withstand harsh environments, providing reliable thermal management where it's needed most. Industries such as automotive, aerospace, and telecommunications can benefit from its superior cooling capabilities. In automotive applications, it is ideal for cooling electric vehicle components, while in aerospace, it ensures the reliability of avionics systems. Telecommunications equipment also benefits from its ability to maintain stable temperatures in networking gear and base stations. TE Connectivity AMP Connectors has designed this heat sink with a focus on durability and performance, ensuring it meets the rigorous demands of modern industries. Its lightweight yet sturdy construction allows for easy installation without compromising on strength. For businesses looking to improve their thermal management strategies, the 1963783-2 offers a proven solution backed by TE Connectivity AMP Connectors's expertise. Don't let heat-related issues disrupt your operations reach out to us today to request a quote and discover how this heat sink can benefit your application.

General specs

  • Product Status: Active
  • Type: Top Mount
  • Package Cooled: QSFP-DD (Double Density)
  • Attachment Method: Adhesive
  • Shape: Rectangular, Pin Fins
  • Length: 1.801" (45.74mm)
  • Width: 0.738" (18.75mm)
  • Diameter: -
  • Fin Height: 0.256" (6.50mm)
  • Power Dissipation @ Temperature Rise: -
  • Thermal Resistance @ Forced Air Flow: -
  • Thermal Resistance @ Natural: -
  • Material: Aluminum
  • Material Finish: Nickel

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