BQ4015YMA-70
Texas Instruments

Texas Instruments
IC NVSRAM 4MBIT PAR 32DIP MODULE
$53.44
Available to order
Reference Price (USD)
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$53.44000
500+
$52.9056
1000+
$52.3712
1500+
$51.8368
2000+
$51.3024
2500+
$50.768
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Product details
Texas Instruments's BQ4015YMA-70 memory IC sets new standards in non-volatile storage technology, delivering robust performance for mission-critical applications. This memory solution offers the perfect balance of speed, capacity, and reliability, engineered to meet the evolving needs of modern electronics. Its architecture ensures data persistence without constant power supply.
The BQ4015YMA-70 features include advanced wear-leveling algorithms, error correction capabilities, and wide temperature operation range. These attributes make it particularly valuable for applications requiring long-term data retention and consistent performance. The memory IC supports various interface protocols, enabling easy integration into existing system designs.
Primary applications include automotive telematics systems, industrial programmable logic controllers, and smart grid infrastructure. The BQ4015YMA-70 is also ideal for wearable health monitors, digital signage solutions, and edge computing devices. Its reliability makes it suitable for aerospace black box recorders and underground mining equipment.
Discover the full potential of this Texas Instruments memory IC by submitting your inquiry through our online portal. Our sales team will provide detailed specifications and competitive pricing options for the BQ4015YMA-70 to meet your project timeline and budget requirements.
General specs
- Product Status: Obsolete
- Memory Type: Non-Volatile
- Memory Format: NVSRAM
- Technology: NVSRAM (Non-Volatile SRAM)
- Memory Size: 4Mb (512K x 8)
- Memory Interface: Parallel
- Clock Frequency: -
- Write Cycle Time - Word, Page: 70ns
- Access Time: 70 ns
- Voltage - Supply: 4.5V ~ 5.5V
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: Through Hole
- Package / Case: 32-DIP Module (0.610", 15.49mm)
- Supplier Device Package: 32-DIP Module (18.42x42.8)