XCZU19EG-L1FFVC1760I
AMD Xilinx
AMD Xilinx
IC SOC CORTEX-A53 1760FCBGA
$8,218.86
Available to order
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$6,848.64000
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XCZU19EG-L1FFVC1760I
$8,218.86
Product details
Enhance your embedded systems with the XCZU19EG-L1FFVC1760I from AMD Xilinx, a feature-rich System on Chip (SoC) designed for high-performance applications. This SoC integrates a multicore processor with advanced acceleration units, delivering unparalleled processing power. Its low-latency design ensures real-time responsiveness, critical for time-sensitive applications. The XCZU19EG-L1FFVC1760I offers extensive connectivity options, including high-speed interfaces and wireless capabilities. With its robust security features, this SoC is perfect for secure communications and data protection. Ideal for use in autonomous vehicles, smart appliances, and industrial IoT, the XCZU19EG-L1FFVC1760I provides the reliability and performance you need. Its flexible architecture supports a variety of development environments, reducing time-to-market. Discover how this SoC can transform your projects in aerospace, healthcare monitoring, and energy management systems. To learn more about the XCZU19EG-L1FFVC1760I and to place an order, submit your inquiry online today.
General specs
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 500MHz, 600MHz, 1.2GHz
- Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1760-FCBGA (42.5x42.5)
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